Monocure3D RESINAWAY EZY-WIPES are a multi-purpose solution to quickly & effectively clean resin residue & other difficult-to-remove contaminants from equipment, tools & hard surfaces.
APPLICATIONS
It removes 3D printing resins, silicones, adhesives, label residue, paint, rust, water stains, tar, grease, and grime for residential, commercial, retail, or industrial use.
AREAS OF USE
Solvent-resistant substrates include glass, ceramics, metal, most plastics, chrome, stainless steel, rubber, laminates, stone, bench tops, plus many more!
WARNINGS
RESINAWAY® EZY-WIPES™ can cause damage to painted surfaces and some plastics. *ALWAYS TEST BEFORE USE on an inconspicuous area. Monocure3D will not take responsibility for any damage caused by the misuse of this product, which is recommended for equipment, tools and hard surfaces. Avoid prolonged use on the skin. Not approved for medical devices or other therapeutic goods.
SAFETY DIRECTIONS
If accidentally swallowed, call the poisons information centre in your local area. If in eyes, hold eyelids apart and liberally flush with running water. If present, remove contact lenses. Keep flushing until irritation ceases, and seek medical advice. Download the SDS for more information.
Store below 40°C
Use this cleaning agent as is, do not dilute with water. For best results use in conjunction with an ultrasonic cleaning bath (heat is unnecessary). Keep printed objects submerged in RESINAWAY® until the uncured resin has been removed. If you are using without an ultrasonic cleaning bath, use a soft brush will assist in this process. Once clear of resin, remove the object from RESINAWAY®, and for best results, use compressed air to remove the remaining liquid, otherwise pat dry with a lint-free cloth. Then post-cure the part using a recommended LED 405nm light until the surface is tack free (approx. 5mins at 30watts). The final process is to rinse under running tap water. For cleaning vats, build plates, instruments & surfaces, rinse/soak/wipe with RESINAWAY® then wash with fresh water.
